Fairchild Semiconductor (FCS) wasn't fit as a fiddle at the close of 2013. Feeble orders from Samsung (SSNLF), one of its biggest customers, kept Fairchild down, and it was not able to take advantage of its supplier relationship with Apple (AAPL).
A solid comeback
On the other hand, the story is diverse this year. Fairchild has outperformed the NASDAQ Composite list with gains of more than 12% so far in 2014. The organization's request book has enhanced significantly, it has diminished its losses, and prospects at last market seem strong. With everything taken into account, Fairchild is reporting improvements on several fronts, which is the reason it could be a decent turnaround play.
The great thing is that Fairchild investors can anticipate that such improvements will proceed. The organization recorded orders worth $375 million in the previous quarter, outpacing aggregate revenue. Truth be told, the overabundance increased 20% on a sequential basis, fundamentally determined by the mobile business. Fairchild recorded various design wins in Asia, mostly in mid-range devices, for its battery charging and force administration solutions.
Hot Mid Cap Stocks To Own For 2015: Peregrine Semiconductor Corp (PSMI)
Peregrine Semiconductor Corporation (Peregrine), incorporated in February 1990, is engaged in the design, manufacturing and marketing radio frequency integrated circuits (RFICs) for the aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment, and wireless infrastructure markets. The Company is provider of RFICs. Its products include RF switches-antenna, RFswitches-broadband and general purpose, digital attenuators, synthesizers, mixers/upconverters, prescalers, variable gain amplifiers, digitally tunable capacitors, DC-DC converters and power amplifiers. Its UltraCMOS technology enables the design, manufacture, and integration of multiple radio frequency (RF), mixed signal, and digital functions on a single chip. Its solutions target a range of applications in the aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment, and wireless infrastructure markets.
As of December 25, 2010, The Company offers a portfolio of more than 120 RFICs, including switches, digital attenuators, mixers/upconverters, and prescalers, and it is developing power amplifiers (Pas), digitally tunable capacitors (DTCs), and DC-DC converters. During the fiscal year ended December 25, 2010, its products were sold to more than 1,400 module manufacturers, original equipment manufacturers (OEMs), contract manufacturers, and other customers, including such companies as Amalfi Semiconductor, Inc., The Boeing Company, EPCOS AG, Ericsson AB, Hitachi Media Electronics Company, Ltd., Hitachi Metals, Ltd., Humax Co., Ltd., Itron, Inc., LG Innotek Co., Ltd., Mini-Circuits, Inc., Motorola, Inc., Murata Manufacturing Company, Ltd., Planet Technology Corp., Rockwell Collins, Inc., Rohde & Schwarz, Inc., SIPAT Co., Ltd., Skyworks Solutions, Inc., Sony Corporation, Source Photonics, Inc., and Thales Alenia Space.
RF switches-antenna
RF Switches are utilized in the RF section of mobile devices to route RF signals between! the antenna and the handset core, through one or more signal paths. For mobile handsets, its switch products offer up to 10 RF signal paths with integrated digital bus support and onboard voltage regulation.
RFswitches-broadband and general purpose
The Company�� broadband and general purpose RF switches deliver combination of broadband linearity, settling time, and isolation while routing RF signals to their respective transmit or receive paths. Its attributes are being used by the OEMs of LED and plasma digital televisions (DTVs), set top box, cable infrastructure, test and measurement devices
Digital Attenuators
The Company provides digital step attenuators that are used to control the amplitude of an RF or analog signal. The products include digital control circuitry integrated with an RF attenuator core and are used in third generation (3G) and fourth generation (4G) cellular base stations, repeaters, and point-to-point nodes.
Synthesizers
The Company�� frequency synthesizers provide an electronic system for generating any of a range of frequencies from a single fixed timebase or oscillator. Its synthesizers provide low-power, ultra-low phase noise, programmable frequency synthesis for defense, broadband, industrial, and wireless infrastructure markets.
Mixers/Upconverters
The Company�� mixers/upconverters are used to translate encoded voice/data signals from one frequency to another to enable radio transmission. Its mixers / upconverters are incorporated into mixer modules and provide industry linearity, which is a metric to maximizing wireless data transmission rates. These attributes are critical in 3G and 4G cellular base station designs.
Prescalers
The Company�� prescalers operate in the C, X, and Ku bands to divide the frequency of a wireless signal in order to extend the operating range of a synthesizer beyond its base capability. Its prescalers complem! ent its f! requency synthesizer line, providing its customers with design.
Variable Gain Amplifiers
The Company�� Variable Gain Amplifiers (VGAs) are used in both the receiving and transmitting path of a radio system to maintain a signal�� strength at a level necessary for other circuits to operate optimally. Its DVGA is the monolithic integrated circuit (IC) to integrate three functional blocks, including digital attenuators, RF/IF amplifiers and a common serial interface onto a single IC.
DC-DC Converters
The Company�� frequency-configurable DC-DC converters efficiently perform voltage conversion using a high frequency switching technique that minimizes system noise. Its DC-DC converters are designed to enable a distributed power management architecture designed for satellite applications, replacing inefficient drop out regulators and central converters.
Power Amplifiers
The Company�� PAs amplify RF signals in order to generate the necessary power required to establish a radio link between a base station and a mobile device. With its UltraCMOS technology the Company has the ability to integrate its PAs on a single chip with other RF, mixed signal, and digital components.
The Company competes with Hittite, M/A-COM, NEC, Renesas, RFMD, Skyworks, Sony, Toshiba and TriQuint Semiconductor.
Advisors' Opinion:- [By Lee Jackson]
Peregrine Semiconductor Corp. (NASDAQ: PSMI) is a lesser known name that is a top stock to buy at Deutsche Bank. The company recently released a new radio frequency (RF) switch specifically designed for broadband cable systems. With HD content exploding, this could be a huge home run for the company. Deutsche Bank has a $14 price target for the stock, the same as the consensus target.
Top 10 Semiconductor Companies For 2014: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By David Dittman]
Crown Resorts is a buy all the way up to USD16.50 on the Australian Securities Exchange (ASX) using the symbol CWN and on the US over-the-counter (OTC) market using the symbol CWLDF.
- [By Adam Haigh]
ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.
- [By Jeff Reeves]
Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. It�� not as sexy as some mobile chipmakers, but thankfully it doesn�� have to be — ASX is simply capitalizing on the general demand for microchips in everything from cars to computers to TVs.
- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
Top 10 Semiconductor Companies For 2014: USmart Mobile Device Inc (UMDI)
USmart Mobile Device Inc., formerly ACL Semiconductors Inc., incorporated on September 17, 2002, the Company is engaged primarily in the business of distributing memory products under the Samsung brand name, which consists of Dynamic Random Access Memory (DRAM), Graphic Random Access Memory (Graphic RAM) and Flash for the Hong Kong and Southern China markets. The primary products the Company distributes and sells include Synchronous Dynamic Random Access Memory (SDRAMs), DDRs (DDR1, DDR2 and DDR3), Flash memory, Graphic RAM and LCD panels. In September 2012, the Company acquired Jussey Investments Limited.
Synchronous Dynamic Random Access Memory (SDRAMs), or mobile SDRAM, are used semiconductor memory component in computer peripherals, such as Hard Disk Drives (HDD), Digital Still Camera (DSC), Modems, ADSL Applications, DVD player, Set-top Box (STB), Digital TV, High Definition TV (HDTV) and Portable Multimedia Players (PMP). DDRs (DDR1, DDR2 and DDR3) are random access memory components that transfer data on both 0-1 and 1-0 clock transitions, theoretically yielding twice the data transfer rate of normal RAM or SDRAM.
Flash memory is a specialized type of memory component used to store user data and program code; it retains this information even when the power is off. Although Flash is predominantly used in mobile phones and tablets, it is commonly used in multi-media digital storage applications for products, such as moving picture experts group layer-3 audio (MP3) players, digital still camera DSC, Digital Voice Recorders, universal serial bus (USB) Disks and Flash Cards. Graphic RAM is a special purpose DDR (GDDR1, GDDR2, GDDR3, GDDR4) that is used in graphic products which require high-speed 3-dimensional calculation performance and a memory size to be used as data storage buffer for digital versatile disc (DVD) and computer game displays. LCD panels are a component in consumer electronics, such as LCD TVs, tablets, smartphones, notebooks, digital phone frames and por! table game consoles.
The Company competes with Toshiba, Hynix, Nanya, PSC, Promos, ISSI and ESMT.
Advisors' Opinion:- [By Peter Graham]
Last Friday, small cap stocks MedCAREERS Group Inc (OTCMKTS: MCGI), USmart Mobile Device Inc (OTCMKTS: UMDI) and Drinks Americas Holdings, Ltd (OTCMKTS: DKAM) were all over the place with the first two sinking 54% and 48.05%, respectively, while the last one rose 10.81%. It should be mentioned that all three small cap stocks have been the subject of paid promotions albeit none of these stocks have been over promoted. So where can investors and traders expect these stocks to head this week? Here is a quick look at what you might expect:
Top 10 Semiconductor Companies For 2014: Broadcom Corporation(BRCM)
Broadcom Corporation designs and develops semiconductors for wired and wireless communications. It provides a portfolio of system-on-a-chip (SoC) and software solutions for the manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices, which enable the delivery of voice, video, data, and multimedia content to the home, office, and mobile environment. Its broadband communications products include cable modem SoCs; femtocell SoCs; MPEG/AVC/VC-1 encoders and transcoders; xDSL, passive optical network, and cable modem customer premises equipment and central office solutions; powerline networking SoCs; digital cable, direct broadcast satellite, terrestrial, and Internet protocol (IP) set-top box integrated receiver demodulators; high definition television and standard definition TV SoCs; and Blu-ray disc SoCs. The company?s mobile and wireless products comprise Wi-Fi and Bluetooth SoCs, wireless connectivity com bo chips, global positioning system SoCs, multimedia processors, applications processors, power management units, VoIP SoCs, mobile TV SoCs, and near field communications tags. Its infrastructure and networking products include Ethernet copper transceivers, Ethernet controllers and switches, backplane and optical front-end physical layer devices, security processors and adapters, and broadband processors. The company markets and sells its products through direct sales force, distributors, and manufacturers? representatives in the United States, as well as through regional offices, and a network of independent distributors and representatives in Asia, Australia, Europe, and North America. The company was founded in 1991 and is headquartered in Irvine, California.
Advisors' Opinion:- [By Vinay Singh]
The only close competitor to Snapdragon 800 is NVIDIA�(NVDA)'s fourth generation Tegra chips, Tegra 4i, which are expected to be launched in the beginning of next year, and Broadcom�� (BRCM) recently launched BCM21892. The Tegra 4i will be half the size of Snapdragon 800 processor and BCM21892 is currently the smallest LTE 4G enabled chip in the industry. The smaller size of the chips makes them cheaper to produce and more energy efficient. However, Qualcomm�� earlier launch of its Snapdragon 800 processor with an LTE ��dvanced feature places it in an advantageous position, as there is no other competing product.
Top 10 Semiconductor Companies For 2014: Tokyo Electron Ltd (TOELY.PK)
Tokyo Electron Limited is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. The Semiconductor Manufacturing Equipment, Flat-panel Display (FPD) and Photovoltaic Cell (PV) Manufacturing Equipment segment provides coaters and developers for wafer processing, plasma etching equipment, thermal processing systems, single wafer deposition systems, cleaning systems, coaters and developers for FPD manufacturing, ashing devices and plasma chemical vapor deposition (CVD) devices. The Electronic Component and Information Communication Equipment segment designs, develops, purchases and sells semiconductor products such as integrated circuits (ICs), computer and network equipment and software. The Others segment involves in logistics, facility management and insurance businesses. On April 1, 2013, it merged with two subsidiaries. In January 2014, the Company established TEL-Applied Holdings B.V. and a Japan-based company. Advisors' Opinion:- [By Stephen Simpson, CFA]
Ultratech isn't the only game in town, though, and there are multiple technologies and process steps that are going to play significant roles in the production of FinFETs and 3D circuits. With that, I would take a look at Mattson Technologies (MTSN), as this company has already accomplished the not-so-easy task of gaining meaningful share in the dry strip, rapid thermal processing (RTP), and etch markets despite competing with giants like Lam Research (LRCX), Applied Materials (AMAT), and Tokyo Electron (TOELY.PK).
Top 10 Semiconductor Companies For 2014: Rood Testhouse International NV (ROO)
Rood Testhouse International NV (RoodMicrotec) is a Netherlands-based company, operating an independent and certified test house and analysis lab for opto- and microelectronics. It is a supply chain management organization engaged in partial processes essential to reliable end-products. Its core services are managing the entire process from design idea all the way to supply to the end-user, including purchasing, logistics, warehousing/logistics; securing testability and manufacturability at an early stage in the chip design process. Its activities include supply chain amangement, test and end-of-line services, failure and technology analysis, test engineering, qualifications and reliability, as well as engineering/consulting/key account project management. It has six wholly owned subsidiaries: RoodMicrotec International B.V., RoodMicrotec Holding GmbH, RoodMicrotec Beteiligungs GmbH, RoodMicrotec Nordlingen GmbH + Co. KG, RoodMicrotec Dresden GmbH and RoodMicrotec Stuttgart GmbH. Advisors' Opinion:- [By Alan Ellman]
The day is Friday July 12, and the stock is LEAP Wireless International Inc. (LEAP), which is a takeover candidate by AT&T. In the late afternoon, the share price was near $8 per share, the July $9 call option was priced @ $0.10, and the August $9 call @ $0.40. Covered call writers could generate an initial profit (ROO) of 1% and 5%, respectively. The average daily option trading volume for this company is 1320 contracts over the last three months. It appeared to be a normal trading day until the last hour of trading when option volume went through the roof. By day’s end, 7139 contracts were traded, all but 350 were calls as traders were taking a bullish stance on this stock. I think you know what’s coming!
Top 10 Semiconductor Companies For 2014: NextStage Inc (NXT)
NextStage, Inc. is a holding company. The Company is engaged in the management of its investments in shares of stocks of its subsidiaries. The Company�� subsidiaries include Mondex Philippines Inc. (MXP), Infinit-e Asia Inc. (Infinit-e Asia) and Technology Support Services, Inc. (TSSI). MXP operates a multi-application smart card system in Philippines. Infinit-e Asia is a software development company specializing on smart card and e-commerce solutions tailored to enhance the business of its clients. Infinit-e Asia develops smart card solutions for both real and online applications and on both contact and contactless platform. Infinit-e Asia�� spectrum of products and applications are classified as payments, data capture and security. TSSI is engaged in the business of business process outsourcing (BPO), applications service providers (ASP) and managed service providers (MSP). Advisors' Opinion:- [By Namitha Jagadeesh]
HSBC Holdings Plc (HSBA), Europe�� largest bank, slid 2.1 percent. International Consolidated Airlines Group SA (IAG) declined 2 percent as it canceled some of its flights following a disruption caused by one of its planes at Heathrow airport. Next Plc (NXT) retreated 2.4 percent as Morgan Stanley cut its recommendation on the shares.
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